We recently published a list of Top 11 AI News and Ratings You Should Take a Look At. In this article, we are going to take a look at where Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM ...

TL;DR: NVIDIA is shifting from CoWoS-S to CoWoS-L advanced packaging for its Blackwell AI GPUs, requiring increased capacity from TSMC, the leader in semiconductor technology. This transition aims ...

As Nvidia ramps up production of its multi-chiplet Blackwell-series products, the company will use more CoWoS-L packaging capacity and less CoWoS-S packaging capacity, the company's chief ...

Nvidia's high-priority Blackwell GPU models use TSMC's more advanced CoWoS-L technology. The discontinued B200A and the single-die B300 GPUs both use CoWoS-S. Due to these changes, certain ...

During the inauguration ceremony of SPIL on January 16, Nvidia founder and CEO Jensen Huang stated that the Blackwell system has now fully entered production, which will gradually enhance CoWoS-L ...

Huang explained the transition in Nvidia's chip packaging requirements. "As we move into Blackwell, we will use largely CoWoS-L. Of course, we're still manufacturing Hopper, and Hopper will use ...

Nvidia's (NASDAQ:NVDA) latest Blackwell lineup suggests it will reduce ... features a dual-die design and is manufactured using CoWoS-L. The 300 series, which includes the GB300 NVL72 and HGX ...

TSMC's AI demand and robust financial health highlight its growth. Find out why TSM stock, along with DeepSeek’s ...

It's actually increasing capacity into CoWoS-L." Hopper refers to Nvidia's GPU architecture platform before it announced Blackwell in March 2024. Nvidia has so far relied mainly on one type of ...